Simulation Characterization of Patch Antenna using Ultra Thin Conductors for Wireless LAN Applications
Rajendra R Patil, Vani R M and P V Hunagund. Article: Simulation Characterization of Patch Antenna using Ultra Thin Conductors for Wireless LAN Applications. IJCA Proceedings on National Conference on Recent Advances in Information Technology NCRAIT(4):1-4, February 2014. Full text available. BibTeX
@article{key:article,
author = {Rajendra R. Patil and Vani R. M and P. V. Hunagund},
title = {Article: Simulation Characterization of Patch Antenna using Ultra Thin Conductors for Wireless LAN Applications},
journal = {IJCA Proceedings on National Conference on Recent Advances in Information Technology},
year = {2014},
volume = {NCRAIT},
number = {4},
pages = {1-4},
month = {February},
note = {Full text available}
}
Abstract
This paper reports simulated performance analysis of microstrip patch antenna with conducting/radiating patch thickness less than one skin depth (SK) in terms of antenna bandwidth. For performance analysis antenna is designed and modeled for 5. 8 GHz applications like WLAN, for which conducting metal copper's fraction of skin depth lies in the nano thickness (1 to 100 nm) range. In this study IE3D industrial standard electromagnetic simulator is used. The fractional skin depth thickness radiating patch is excited through a feeding mechanism known as electromagnetically coupled or proximity feed. The simulation result shows increased bandwidth. The improvement in bandwidth makes antenna more tolerant to variations in fabrication without compromising the operation of the antenna.
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